US 12,362,210 B2
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
Keita Okubo, Toyama (JP); Makoto Nomura, Toyama (JP); and Kazuhito Saito, Toyama (JP)
Assigned to Kokusai Electric Corporation, Tokyo (JP)
Filed by Kokusai Electric Corporation, Tokyo (JP)
Filed on Sep. 7, 2022, as Appl. No. 17/939,582.
Claims priority of application No. 2021-153956 (JP), filed on Sep. 22, 2021.
Prior Publication US 2023/0093324 A1, Mar. 23, 2023
Int. Cl. H01L 21/67 (2006.01); H01L 21/677 (2006.01)
CPC H01L 21/67276 (2013.01) [H01L 21/67745 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a plurality of process chambers in which a substrate among a plurality of substrates is processed;
a transfer chamber provided with a transfer structure configured to transfer the substrate; and
a controller configured to perform:
(a) calculating a substrate transferable time during which the substrate is transferable to each of the plurality of process chambers;
(b) selecting a substrate transfer path to a process chamber among the plurality of process chambers such that the substrate transferable time is the shortest among those calculated in (a);
(c) performing a control of the transfer structure based on the substrate transfer path selected in (b); and
(d) controlling a start time of a pre-processing in the process chamber such that the substrate transferable time arrives in accordance with an elapse of a processing startable time based on the substrate transferable time to the process chamber and the processing startable time of the substrate in the process chamber.