US 12,362,201 B2
Bevel edge removal methods, tools, and systems
Hui-Chi Huang, Zhubei (TW); Jeng-Chi Lin, Hsinchu (TW); Pin-Chuan Su, Hsinchu (TW); Chien-Ming Wang, Tainan (TW); and Kei-Wei Chen, Tainan (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jul. 25, 2022, as Appl. No. 17/872,620.
Application 17/872,620 is a division of application No. 16/727,533, filed on Dec. 26, 2019, granted, now 11,664,213.
Prior Publication US 2022/0359191 A1, Nov. 10, 2022
Int. Cl. H01L 21/02 (2006.01); A46B 13/04 (2006.01); B08B 1/00 (2024.01); B08B 1/04 (2006.01); B08B 1/12 (2024.01); B08B 1/32 (2024.01); B08B 3/08 (2006.01); B08B 5/04 (2006.01); B08B 7/04 (2006.01)
CPC H01L 21/02087 (2013.01) [A46B 13/04 (2013.01); B08B 1/12 (2024.01); B08B 1/32 (2024.01); B08B 3/08 (2013.01); B08B 5/04 (2013.01); B08B 7/04 (2013.01); A46B 2200/30 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device processing system comprising:
an inner motor comprising a top surface that is a rotatable platform, the inner motor being nested within a first motor;
a bevel brush attached to the first motor, wherein the bevel brush surrounds the top surface in a top down view, wherein the bevel brush comprises a first portion and a second portion movable relative to the first portion, wherein the first portion and the second portion are arranged in a circle in a top down view; and
a groove located within the bevel brush.