US 12,362,123 B2
Fuse element
Misato Ueki, Mie (JP); Yutaka Takata, Mie (JP); Kotaro Takada, Osaka (JP); and Shinichiro Yoshida, Osaka (JP)
Assigned to AUTONETWORKS TECHNOLOGIES, LTD., Mie (JP); SUMITOMO WIRING SYSTEMS, LTD., Mie (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Appl. No. 18/283,767
Filed by AUTONETWORKS TECHNOLOGIES, LTD., Mie (JP); SUMITOMO WIRING SYSTEMS, LTD., Mie (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
PCT Filed Mar. 10, 2022, PCT No. PCT/JP2022/010503
§ 371(c)(1), (2) Date Sep. 22, 2023,
PCT Pub. No. WO2022/209695, PCT Pub. Date Oct. 6, 2022.
Claims priority of application No. 2021-057150 (JP), filed on Mar. 30, 2021.
Prior Publication US 2024/0194434 A1, Jun. 13, 2024
Int. Cl. H01H 85/46 (2006.01); H05K 1/16 (2006.01)
CPC H01H 85/463 (2013.01) [H05K 1/16 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/10181 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A fuse element, comprising:
a base layer comprising an insulating base material;
a conductor layer provided on a surface of the insulating base material; and
a protection layer formed of an insulating material and provided on a surface of the conductor layer via at least one of the base layer and an adhesive layer, the protection layer having a specific heat of 1.1 J·g−1·K−1 or more and a specific gravity of 1.0 g·cm−3 or more,
wherein
the insulating base material of the base layer is provided on both surfaces of the conductor layer,
the protection layer is provided on a surface of the insulating base material provided on one of the surfaces of the conductor layer,
the fuse element is configured using a flexible printed circuit board,
the insulating base material and the conductor layer of the fuse element are respectively constituted by a base layer of the flexible printed circuit board and a metal foil of the flexible printed circuit board, and
the protection layer covers the conductor layer via the base layer of the flexible printed circuit board and a layer of an adhesive of the flexible printed circuit board.