US 12,362,078 B2
Photosensitive conductive paste, laminated electronic component, and method of manufacturing laminated electronic component
Yuya Ishima, Tokyo (JP); Masaki Takahashi, Tokyo (JP); Akira Suda, Tokyo (JP); Takashi Suzuki, Tokyo (JP); and Hidenobu Umeda, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Apr. 14, 2021, as Appl. No. 17/230,521.
Claims priority of application No. 2020-073424 (JP), filed on Apr. 16, 2020.
Prior Publication US 2021/0327606 A1, Oct. 21, 2021
Int. Cl. H01F 27/28 (2006.01); G03F 7/004 (2006.01); H01B 1/22 (2006.01); H01F 41/04 (2006.01)
CPC H01B 1/22 (2013.01) [G03F 7/0047 (2013.01); H01F 27/2804 (2013.01); H01F 41/041 (2013.01); H01F 2027/2809 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A photosensitive conductive paste comprising photosensitive organic components, conductor powder, and quartz powder,
wherein the quartz powder has a melting point of about 1600 to 1700° C.,
wherein the photosensitive conductive paste is free of glass powder, and
wherein a median diameter of the conductor powder is larger than a median diameter of the quartz powder.