US 12,362,021 B2
Semiconductor memory
Teppei Higashitsuji, Fujisawa Kanagawa (JP); and Toshifumi Watanabe, Yokohama Kanagawa (JP)
Assigned to Kioxia Corporation, Tokyo (JP)
Filed by Kioxia Corporation, Tokyo (JP)
Filed on Mar. 1, 2023, as Appl. No. 18/177,026.
Claims priority of application No. 2022-128943 (JP), filed on Aug. 12, 2022.
Prior Publication US 2024/0055057 A1, Feb. 15, 2024
Int. Cl. G11C 16/04 (2006.01); G11C 5/06 (2006.01); G11C 16/26 (2006.01)
CPC G11C 16/26 (2013.01) [G11C 5/06 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor memory comprising:
a memory cell;
a bit line electrically connected to the memory cell;
a sense amplifier in a first circuit area and including a first latch circuit;
a first hookup circuit in a second circuit area and configured to control connection between the bit line and the sense amplifier;
a second latch circuit;
a first wiring connected between the first latch circuit and the second latch circuit; and
a first pre-charge circuit including a first transistor in a third circuit area between the first circuit area and the second circuit area, the first transistor having a first end connected to the first wiring at a first position in the third circuit area and a second end connectable to a terminal that is supplied with one of a pre-charge voltage and a ground voltage.