US 12,360,040 B2
Detection method and detection device for detecting concentration of solder flux in reflow oven
Ye Lv, Shenzhen (CN); and Xiujuan Yang, Shenzhen (CN)
Assigned to Honor Device Co., Ltd., Shenzhen (CN)
Appl. No. 18/037,125
Filed by Honor Device Co., Ltd., Shenzhen (CN)
PCT Filed Aug. 25, 2022, PCT No. PCT/CN2022/114774
§ 371(c)(1), (2) Date May 16, 2023,
PCT Pub. No. WO2023/040617, PCT Pub. Date Mar. 23, 2023.
Claims priority of application No. 202111096988.2 (CN), filed on Sep. 18, 2021.
Prior Publication US 2024/0019367 A1, Jan. 18, 2024
Int. Cl. G01N 21/55 (2014.01); B23K 1/008 (2006.01); G01B 11/06 (2006.01)
CPC G01N 21/55 (2013.01) [B23K 1/008 (2013.01); G01B 11/06 (2013.01); G01B 11/0625 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A detection method, comprising:
placing a substrate in a reflow oven, wherein a solder flux volatilized in the reflow oven is capable of adhering to a surface of the substrate to form a solder flux layer;
detecting a thickness of the solder flux layer; and
calculating a concentration of the solder flux in the reflow oven based on the thickness of the solder flux layer.