| CPC C23C 14/3407 (2013.01) [C23C 14/3414 (2013.01); H01J 37/3417 (2013.01); H01J 37/3423 (2013.01); H01J 37/3426 (2013.01); H01J 37/3429 (2013.01); H01J 37/3435 (2013.01)] | 17 Claims |

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1. A sputtering target comprising:
a target insert having an uppermost surface with a first diameter and a bottom surface with a second diameter and comprising a target metal compound comprising a precious metal of at least one of rhodium, ruthenium, platinum, gold, iridium, cobalt, tantalum, tungsten, or silver; and
a skirt structure including a primary skirt having a first thickness, a first diameter, and a top surface, and a secondary skirt having a second thickness and a top portion with a second diameter and a bottom portion with a third diameter, the primary skirt disposed adjacent least a portion of a secondary skirt, and the first thickness less than the second thickness;
the primary skirt comprising a first metal compound and the secondary skirt comprising a second metal compound that is different from the first metal compound;
wherein the top surface of the primary skirt laterally surrounds the uppermost surface of the target insert;
wherein the primary skirt is positioned on top of at least a portion of the secondary skirt;
wherein the secondary skirt is positioned on top of a backing plate;
wherein the target insert is embedded in the primary skirt and the secondary skirt, such that the target insert contacts both the secondary skirt and the primary skirt; and
wherein the first diameter of the primary skirt is substantially the same as the second diameter of the secondary skirt, and the third diameter of the secondary skirt is smaller than the second diameter of the secondary skirt, and the first diameter of the target insert is greater than the second diameter of the target insert.
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