US 12,359,104 B2
Heat and humidity resistant adhesive composition
Zhuming Shi, Shanghai (CN); Cheng Lu, Shanghai (CN); and Jinqian Chen, Shanghai (CN)
Assigned to Henkel AG & Co. KGaA, Duesseldorf (DE)
Filed by Henkel AG & Co. KGaA, Duesseldorf (DE)
Filed on Jun. 28, 2021, as Appl. No. 17/360,394.
Application 17/360,394 is a continuation of application No. PCT/CN2018/124626, filed on Dec. 28, 2018.
Prior Publication US 2021/0324248 A1, Oct. 21, 2021
Int. Cl. C09J 133/10 (2006.01); C08G 18/80 (2006.01); C08K 5/00 (2006.01); C08K 5/09 (2006.01); C08K 5/14 (2006.01); C09J 133/06 (2006.01); C09J 133/08 (2006.01); C09J 133/14 (2006.01)
CPC C09J 133/10 (2013.01) [C08G 18/807 (2013.01); C08K 5/0016 (2013.01); C08K 5/0025 (2013.01); C08K 5/09 (2013.01); C08K 5/14 (2013.01); C09J 133/066 (2013.01); C09J 133/08 (2013.01); C09J 133/14 (2013.01); B32B 2405/00 (2013.01); C08G 2170/00 (2013.01); C08K 5/0041 (2013.01); C09J 2301/408 (2020.08); C09J 2409/00 (2013.01); C09J 2425/00 (2013.01); C09J 2433/00 (2013.01); C09J 2453/00 (2013.01); C09J 2463/00 (2013.01)] 12 Claims
 
1. An adhesive composition comprising:
(a) a first part comprising at least one ethylenically unsaturated monomer which does not contain an active hydrogen; and
(b) a second part comprising at least one initiator,
wherein the first part comprises 0% of methyl methacrylate by weight of the first part,
wherein at least one blocked isocyanate compound having a de-blocking temperature of from 80° C. to 200° C. is presented in at least one of the first part, the second part or an optional separate third part,
wherein the at least one ethylenically unsaturated monomer and the at least one blocked isocyanate compound are mixed in the first part in a temperature range from 25 to 80° C., and wherein the adhesive composition is curable without photocuring, wherein (a) the first part comprises tetrahydrofurfuryl methacrylate, ethylene glycol dimethacrylate, and isobornyl methacrylate.