| CPC C09J 123/22 (2013.01) [B32B 7/12 (2013.01); C09J 5/06 (2013.01); B32B 5/022 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 2255/02 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2270/00 (2013.01); B32B 2555/02 (2013.01); C09J 2423/00 (2013.01)] | 20 Claims |
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1. Hot melt adhesive composition having an enthalpy of crystallization below 5 J/g and comprising:
a) at least 60% by weight of a composition a) comprising:
at least one copolymer A having a needle penetration higher than 15 dmm, wherein the copolymer A comprises from 40 weight % to 80 weight % of 1-butene monomer units; and
at least (co)polymer B having a needle penetration lower than 15 dmm, wherein the (co)polymer B comprises from 40 weight % to 80 weight % of 1-butene monomer units; and
b) from 0% to 30% by weight of at least one tackifying resin.
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