US 12,359,099 B2
Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, and pressure-sensitive adhesive sheet
Daisuke Mizuno, Ibaraki (JP); Kensuke Tani, Ibaraki (JP); and Satoshi Honda, Ibaraki (JP)
Assigned to NITTO DENKO CORPORATION, Ibaraki (JP)
Appl. No. 17/630,874
Filed by NITTO DENKO CORPORATION, Ibaraki (JP)
PCT Filed Jul. 29, 2020, PCT No. PCT/JP2020/029086
§ 371(c)(1), (2) Date Jan. 27, 2022,
PCT Pub. No. WO2021/020451, PCT Pub. Date Feb. 4, 2021.
Claims priority of application No. 2019-140059 (JP), filed on Jul. 30, 2019.
Prior Publication US 2022/0315808 A1, Oct. 6, 2022
Int. Cl. C09J 7/38 (2018.01)
CPC C09J 7/385 (2018.01) 4 Claims
OG exemplary drawing
 
1. A pressure-sensitive adhesive composition, comprising
a compound having a substituent represented by the following general formula (1),
wherein,
the compound is a polymer containing a structure derived from a (meth) acrylate monomer whose homopolymer has a glass transition temperature of 10° C. or lower, and
when each of R1 and R2 in the substituent represented by the general formula (1) represents a hydrogen atom, a distance between an oxygen atom of —OR1 and an oxygen atom of —OR2 is 1.31 Å or more and 4.70 Å or less

OG Complex Work Unit Chemistry
(in the general formula (1), L represents a phosphorus atom, or a boron atom; and each of R1 and R2 independently represents a hydrogen atom, or an aliphatic hydrocarbon group, an aryl group or a heterocyclic group which may have a substituent).