US 12,359,097 B2
Low bond-temperature hot melt adhesive with high impact strength and chemical resistance
Paul Kurtz, Bloomfield, NJ (US); Bo Sun, Carlstadt, NJ (US); Philippe Schottland, Carlstadt, NJ (US); Ewelina Szymczak, Carlstadt, NJ (US); Jerome Moyer, Carlstadt, NJ (US); and Saeid Savarmand, Carlstadt, NJ (US)
Assigned to Sun Chemical Corporation, Parsippany, NJ (US)
Appl. No. 18/874,935
Filed by Sun Chemical Corporation, Parsippany, NJ (US)
PCT Filed Aug. 18, 2023, PCT No. PCT/US2023/030620
§ 371(c)(1), (2) Date Dec. 13, 2024,
PCT Pub. No. WO2024/039874, PCT Pub. Date Feb. 22, 2024.
Claims priority of provisional application 63/399,022, filed on Aug. 18, 2022.
Prior Publication US 2025/0163300 A1, May 22, 2025
Int. Cl. C09J 7/35 (2018.01); C09J 123/12 (2006.01); C09J 167/00 (2006.01)
CPC C09J 7/35 (2018.01) [C09J 123/12 (2013.01); C09J 167/00 (2013.01); C09J 2203/326 (2013.01); C09J 2301/304 (2020.08); C09J 2423/10 (2013.01); C09J 2467/00 (2013.01); C09J 2491/00 (2013.01)] 17 Claims
 
1. A hot melt adhesive composition comprising:
60 to 97% by weight of an amorphous polyester resin and polypropylene resin with a Tg≤0° C., based on the total weight of the composition;
wherein the loss modulus of the adhesive at 20° C. and at an oscillation frequency of 10 kiloHertz is greater than 25 MPa.