| CPC C07D 513/04 (2013.01) [C07B 2200/13 (2013.01)] | 6 Claims |

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1. A crystalline form of a compound of formula (II),
![]() having characteristic diffraction peaks in an X-ray powder diffraction pattern using Cu Kα radiation at the following 2θ: 6.25±0.20°, 12.58±0.20°, 14.33±0.20°, 16.15±0.20°, 20.00±0.20°, 20.57±0.20°, 21.79±0.20° and 28.02±0.20°; or, having characteristic diffraction peaks in an X-ray powder diffraction pattern using Cu Kα radiation at the following 2θ: 6.25±0.20°, 16.15±0.20° and 21.79±0.20°; or, having characteristic diffraction peaks in an X-ray powder diffraction pattern using Cu Kα radiation at the following 2θ: 6.25±0.20°, 12.58±0.20°, 14.33±0.20°, 16.15±0.20°, 20.00±0.20°, 21.53±0.20° and 21.79±0.20°; or, having characteristic diffraction peaks in an X-ray powder diffraction pattern using Cu Kα radiation at the following 2θ: 6.25±0.20°, 12.58±0.20°, 14.33±0.20°, 16.15±0.20°, 20.00±0.20°, 20.57±0.20°, 21.79±0.20° and 28.02±0.20°; or, having characteristic diffraction peaks in an X-ray powder diffraction pattern using Cu Kα radiation at the following 2θ: 6.25±0.20°, 11.95±0.20°, 12.58±0.20°, 14.33±0.20°, 16.15±0.20°, 19.46±0.20°, 20.00±0.20°, 20.57±0.20°, 21.79±0.20°, 23.87±0.20°, 28.02±0.20° and 30.81±0.20°; or, having characteristic diffraction peaks in an X-ray powder diffraction pattern using Cu Kα radiation at the following 2θ: 6.25±0.20°, 8.06±0.20°, 9.29±0.20°, 11.95±0.20°, 12.58±0.20°, 14.33±0.20°, 16.15±0.20°, 16.41±0.20°, 19.46±0.20°, 20.00±0.20°, 20.57±0.20°, 21.53±0.20°, 21.79±0.20°, 27.71±0.20° and 28.02±0.20°; or, having an XRPD pattern using Cu Kα radiation at the following 2θ: 6.25±0.20°, 8.06±0.20°, 9.29±0.20°, 11.50±0.20°, 11.95±0.20°, 12.58±0.20°, 14.33±0.20°, 16.15±0.20°, 16.41±0.20°, 18.20±0.20°, 18.75±0.20°, 19.46±0.20°, 20.00±0.20°, 20.57±0.20°, 21.53±0.20°, 21.79±0.20°, 23.1±10.20°, 23.87±0.20°, 24.31±0.20°, 25.26±0.20°, 26.14±0.20°, 26.70±0.20°, 27.71±0.20°, 28.02±0.20°, 28.50±0.20°, 29.09±0.20°, 30.06±0.20°, 30.81±0.20°, 32.39±0.20°, 33.21±0.20° and 33.71±0.20°.
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