US 12,358,570 B2
Movable spoiler device
Yuki Nakamura, Tokyo (JP); Kei Ambo, Tokyo (JP); and Kenichi Ando, Saitama (JP)
Assigned to Honda Motor Co., Ltd., Tokyo (JP)
Filed by Honda Motor Co., Ltd., Tokyo (JP)
Filed on Feb. 7, 2023, as Appl. No. 18/165,338.
Claims priority of application No. 202210173446.9 (CN), filed on Feb. 24, 2022.
Prior Publication US 2023/0264761 A1, Aug. 24, 2023
Int. Cl. B62D 35/00 (2006.01); B60R 16/03 (2006.01)
CPC B62D 35/007 (2013.01) [B60R 16/03 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A movable spoiler device, comprising:
a fixed plate fixed on a vehicle body of a vehicle;
a movable plate arranged to be movable between a storing position and an unfolding position closer to the rear than the storing position;
a link mechanism, provided with one end pivotally supported on the fixed plate and the other end pivotally supported on the movable plate;
an electrical component arranged in the vicinity of the movable plate; and
a wire harness configured for connecting the electrical component to a battery arranged on the vehicle body, wherein
a first portion of the wire harness is fixed at the other end of the link mechanism corresponding to the movable plate, and a second portion of the wire harness is bent on the one end of the link mechanism corresponding to the fixed plate.