US 12,358,319 B2
Integrated envelope sealer and flip module
Arthur H. Depoi, Brookfield, CT (US); John Robert Masotta, Newtown, CT (US); Boris Rozenfeld, Danbury, CT (US); Daniel Wright, Holmes, NY (US); and Anthony E. Yap, Palmyra, PA (US)
Assigned to DMT Solutions Global Corporation, Danbury, CT (US)
Filed by DMT Solutions Global Corporation, Danbury, CT (US)
Filed on Feb. 16, 2024, as Appl. No. 18/443,825.
Application 18/443,825 is a continuation of application No. 17/550,479, filed on Dec. 14, 2021, granted, now 11,904,626.
Application 17/550,479 is a continuation of application No. 16/799,715, filed on Feb. 24, 2020, granted, now 11,230,139, issued on Jan. 25, 2022.
Prior Publication US 2024/0181800 A1, Jun. 6, 2024
Int. Cl. B43M 5/00 (2006.01); B43M 5/04 (2006.01)
CPC B43M 5/042 (2013.01) 10 Claims
OG exemplary drawing
 
1. A method for sealing and flipping an envelope, the method comprising:
receiving a body of an envelope face-down between a pair of nip rollers mounted to a frame;
wetting a flap of the envelope to activate an adhesive substance thereon, wherein wetting the flap comprises:
lowering a moveable brush into contact with the flap portion prior to rotating the frame, wherein the moveable brush is actuated by a servomotor; and
setting a brush contact height by recording a position at which the moveable brush contacts a moistening pad with the servomotor in an open loop mode;
rotating the frame with the body of the envelope secured between the nip rollers to flip the envelope face-up and to cause the flap to bear against a paper guide to form a bend between the flap and the body; and
drawing the bend into a sealer nip with the envelope face-up to press the adhesive substance against the body, to form a seal between the flap and the body of the envelope.