| CPC B29C 64/135 (2017.08) [B29C 64/176 (2017.08); B29C 64/264 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12)] | 12 Claims |

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1. A method of step-wise exposing a voxel of a resist to radiation for forming a three-dimensional structure, the method comprising:
setting a step size to a first resolution;
setting a voxel volume to a first volume;
exposing a first set of voxels of said first volume to radiation using said first resolution;
setting the step size to a second resolution being smaller than said first resolution, or, respectively, greater than said first resolution;
setting the voxel volume to a second volume being smaller than said first volume, or, respectively, greater than said first volume;
exposing a second set of voxels of said second volume to radiation using said second resolution; and
manufacturing of a sensor substrate for a microchannel sensor,
wherein in said sensor substrate one or more channel zones and a support part are formed, wherein one or more channel zones are formed by at least exposing a first set of voxels of said first volume using said first resolution and said support part is formed by at least exposing a second set of voxels of said second volume using said second resolution, said second volume being greater than said first volume.
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