US 12,358,078 B2
Laser machining device
Kazuhiro Yoshida, Tokyo (JP); Yoshinao Komatsu, Tokyo (JP); Saneyuki Goya, Tokyo (JP); Akiko Inoue, Tokyo (JP); Yasuyuki Fujiya, Tokyo (JP); Ryuichi Narita, Tokyo (JP); Masahiko Shimizu, Tokyo (JP); Ryota Ozaki, Tokyo (JP); and Yuki Kani, Tokyo (JP)
Assigned to MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo (JP)
Appl. No. 17/437,941
Filed by MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo (JP)
PCT Filed Jun. 28, 2019, PCT No. PCT/JP2019/025837
§ 371(c)(1), (2) Date Sep. 10, 2021,
PCT Pub. No. WO2020/261537, PCT Pub. Date Dec. 30, 2020.
Prior Publication US 2022/0168848 A1, Jun. 2, 2022
Int. Cl. B23K 26/364 (2014.01); B23K 26/082 (2014.01); B23K 26/14 (2014.01); B23K 26/142 (2014.01)
CPC B23K 26/364 (2015.10) [B23K 26/142 (2015.10); B23K 26/1476 (2013.01); B23K 26/082 (2015.10)] 8 Claims
OG exemplary drawing
 
1. A laser machining device comprising:
a laser irradiation unit that forms a machining groove of which a first end is open to an end portion of a workpiece formed of carbon fiber reinforced by plastic, and a second end and a groove bottom surface are closed, by performing laser machining on the workpiece while scanning a workpiece surface from the end portion of the workpiece; and
a nozzle unit configured to eject a gas for removing a plume over an irradiation range of the workpiece surface on which the laser machining is performed by the laser irradiation unit,
wherein the nozzle unit is disposed above the first end and inclined with respect to the workpiece surface, and is configured so a flow speed of the gas supplied to the irradiation range increases from the first end toward the second end of the machining groove, and
the gas in contact with the groove bottom surface within the machining groove flows from the second end toward the first end.