US 12,357,923 B2
Photothermal evaporator for a desalination system and method of manufacture
Yi Zheng, Canton, MA (US); Ralph Ahlgren, San Jose, CA (US); Mohamed Sonbaty, San Jose, CA (US); and Khushnood Ahmad Qazi, Los Altos, CA (US)
Assigned to Northeastern University, Boston, MA (US); and Soleeva Energy, Inc., San Jose, CA (US)
Appl. No. 18/044,304
Filed by Northeastern University, Boston, MA (US); and Soleeva Energy, Inc., San Jose, CA (US)
PCT Filed Aug. 25, 2021, PCT No. PCT/US2021/047437
§ 371(c)(1), (2) Date Mar. 7, 2023,
PCT Pub. No. WO2022/055703, PCT Pub. Date Mar. 17, 2022.
Claims priority of provisional application 63/075,530, filed on Sep. 8, 2020.
Prior Publication US 2023/0338870 A1, Oct. 26, 2023
Int. Cl. C02F 1/14 (2023.01); B01D 1/00 (2006.01); B01D 1/22 (2006.01); B01D 1/30 (2006.01); C02F 1/04 (2023.01); C23C 22/63 (2006.01); F24S 10/80 (2018.01); F24S 70/20 (2018.01); C02F 103/08 (2006.01)
CPC B01D 1/221 (2013.01) [B01D 1/0035 (2013.01); B01D 1/30 (2013.01); C02F 1/043 (2013.01); C02F 1/048 (2013.01); C02F 1/14 (2013.01); C23C 22/63 (2013.01); F24S 10/80 (2018.05); F24S 70/20 (2018.05); C02F 2103/08 (2013.01); C02F 2305/08 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A photothermal evaporator for use in a water desalination system, comprising:
a planar copper (Cu) foam having a first surface, a second surface opposing the first surface, a thickness therebetween, a first end, a second end, and an interconnected open-pore structure, the first end of the Cu foam positioned in a body of water, the second end positioned above the body of water, and the interconnected open-pore structure delivering water from the first end of the Cu foam to a second end of the Cu foam via capillary action;
and a copper oxide (CuO) layer formed on outer surfaces of the Cu foam and having a flat, tapered nanostructure, the nanostructure converting incident sunlight to heat, the Cu foam positioned such that the first surface receives the heat generated from the CuO layer and conducts the heat across the thickness of the CuO layer, thereby generating a vapor and diffusing the vapor through the first and second surface.