US 12,357,271 B2
Ultrasonic probe, ultrasonic diagnostic apparatus, and method for manufacturing backing material
Kiyokazu Morita, Kokubunji (JP)
Assigned to KONICA MINOLTA, INC., Tokyo (JP)
Filed by Konica Minolta, Inc., Tokyo (JP)
Filed on Dec. 28, 2023, as Appl. No. 18/398,659.
Application 18/398,659 is a division of application No. 17/060,900, filed on Oct. 1, 2020, abandoned.
Claims priority of application No. 2019-190145 (JP), filed on Oct. 17, 2019.
Prior Publication US 2024/0130711 A1, Apr. 25, 2024
Prior Publication US 2024/0225598 A9, Jul. 11, 2024
Int. Cl. A61B 8/00 (2006.01); B06B 1/06 (2006.01); H10N 30/03 (2023.01); H10N 30/80 (2023.01)
CPC A61B 8/4444 (2013.01) [B06B 1/067 (2013.01); H10N 30/03 (2023.02); B06B 2201/76 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A method for manufacturing a backing material used for an ultrasonic probe, the method comprising:
mixing a raw material of a matrix resin, thermally conductive particles, and non-thermally conductive particles to prepare a mixture; and
molding the mixture while the mixture is pressurized and heated to form a backing material, wherein
the thermally conductive particles are made of a thermally conductive material and a number average particle size of the thermally conductive particles is 10 μm to 150 μm,
the thermally conductive particles are oriented in a thickness direction of the backing material,
the raw material of the matrix resin contains powder resin particles, and
a ratio of thermal conductivity of the backing material in the thickness direction to the thermal conductivity of the backing material in a horizontal direction is 3 or more.