US 12,035,576 B2
Substrate treating apparatus and substrate transporting method
Joji Kuwahara, Kyoto (JP); and Koji Kaneyama, Kyoto (JP)
Assigned to SCREEN Holdings Co., Ltd., (JP)
Filed by SCREEN Holdings Co., Ltd., Kyoto (JP)
Filed on Nov. 23, 2020, as Appl. No. 17/101,127.
Claims priority of application No. 2019-214462 (JP), filed on Nov. 27, 2019.
Prior Publication US 2021/0159293 A1, May 27, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 27/12 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 27/118 (2006.01); H01L 27/146 (2006.01); H01L 27/32 (2006.01); H10K 59/124 (2023.01)
CPC H10K 59/124 (2023.02) [H01L 21/67178 (2013.01); H01L 21/67742 (2013.01); H01L 21/67745 (2013.01); H01L 21/67766 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A substrate treating apparatus for treating substrates, comprising:
an indexer block provided with a carrier platform for placing a carrier capable of accommodating substrates, and including a substrate buffer with a plurality of buffer units where the substrates are placed, and an indexer mechanism configured to transport the substrates;
a first treating block including an interface layer configured to load and unload the substrates into and from an external device, and a developing-treatment layer located on an upper part or a lower part of the interface layer; and
a second treating block including a plurality of coating-treatment layers arranged in an up-down direction,
the first treating block, the indexer block, and the second treating block being connected in a horizontal direction in this order,
the indexer mechanism transporting a substrate between the carrier placed on the carrier platform and the substrate buffer,
the indexer mechanism transporting the substrate from one of the buffer units in the substrate buffer located at a predetermined height position to another of the buffer units in the substrate buffer located at a different height position,
the plurality of coating-treatment layers receiving and delivering the substrates from and to the buffer units in the substrate buffer, respectively, the buffer units located at height positions corresponding to the coating-treatment layers, respectively,
the interface layer at least receiving the substrate from a first buffer unit of the buffer units in the substrate buffer, the first buffer unit being located at a height position corresponding to the interface layer,
the developing-treatment layer at least delivering the substrate to a second buffer unit of the buffer units in the substrate buffer, the second buffer unit being located at a height position corresponding to the developing-treatment layer, and
the carrier platform being provided so as to protrude outward from an outer wall of the indexer block,
the substrate treating apparatus further comprising:
a carrier storage shelf configured to store the carrier, and
a carrier transport mechanism configured to transport the carrier between the carrier platform and the carrier storage shelf, wherein
the second treating block is lower in level than the first treating block, and
the carrier storage shelf and the carrier transport mechanism are mounted on the upper face of the second treating block.