US 12,035,514 B2
Liquid cooling device for the arrangement of a power semiconductor device
Harald Kobolla, Seukendorf (DE); Rainer Popp, Petersurach (DE); and Christian Zeller, Pommersfelden (DE)
Assigned to SEMIKRON ELEKTRONIK GMBH & CO. KG, Nuremberg (DE)
Filed by SEMIKRON ELEKTRONIK GMBH & CO. KG, Nuremberg (DE)
Filed on Aug. 5, 2022, as Appl. No. 17/881,929.
Claims priority of application No. 102021120529.8 (DE), filed on Aug. 6, 2021.
Prior Publication US 2023/0038316 A1, Feb. 9, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20927 (2013.01) [H05K 7/20272 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A liquid cooling device, for the arrangement of a power semiconductor device in an assembly, comprising: a main body having a planar surface for said assembly with said power semiconductor device; the main body has a first end face and a second end face opposite the first end face; a plurality of tubular cooling recesses extending from the first end face to the second end face; a first turbulence body arranged in a respective associated cooling recess; the first turbulence body has an active section arranged inside the associated cooling recess and a locking section and whereby the locking section interacts with one of a locking counter-bearing and with a further turbulence body and thus preventing rotation of the active section in the associated cooling recess.