US 12,035,507 B2
Technologies for dynamic cooling in a multi-chip package with programmable impingement valves
Scott Rider, Beaverton, OR (US); and Devdatta Kulkarni, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Apr. 18, 2022, as Appl. No. 17/723,099.
Application 17/723,099 is a continuation of application No. 16/924,789, filed on Jul. 9, 2020, abandoned.
Prior Publication US 2022/0240417 A1, Jul. 28, 2022
Int. Cl. H05K 7/20 (2006.01); H01L 23/24 (2006.01); H01L 23/34 (2006.01); H01L 25/065 (2023.01)
CPC H05K 7/20254 (2013.01) [H01L 23/34 (2013.01); H01L 25/065 (2013.01)] 27 Claims
OG exemplary drawing
 
1. A computing device comprising:
a package including a first die and a second die adjacent to the first die in a side-by-side arrangement;
a first plurality of nozzle valves aligned with the first die to direct a cooling fluid towards the first die, different ones of the first plurality of nozzle valves to be selectively opened or closed independent of other ones of the first plurality of nozzle valves;
a second plurality of nozzle valves aligned with the second die to direct the cooling fluid towards the second die, the second plurality of nozzle valves to be controlled independent of the first plurality of nozzle valves; and
one or more outlets, the cooling fluid to exit through the one or more outlets.