CPC H05K 3/4697 (2013.01) [H05K 1/115 (2013.01); H05K 3/4038 (2013.01); H05K 3/4644 (2013.01); H05K 2201/09036 (2013.01)] | 18 Claims |
1. A printed circuit board comprising:
a first insulating layer composed of a single layer, and having a first through cavity and containing an insulating material,
wherein a length between one side surface and the other side surface opposite to the one side surface of the first through cavity is greater than a thickness of the first insulating layer,
wherein the first insulating layer includes a first recess located in each of an upper edge and a lower edge of the one side surface of the first through cavity,
wherein a first component is disposed in the first through cavity,
wherein the first insulating layer further includes a second through cavity,
wherein a second component is disposed in the second through cavity,
wherein a second recess is further provided at each of an upper edge and a lower edge of one side surface of the second through cavity,
wherein a length between centers of one side surface and the other side surface of the first component is different from a length between centers of one side surface and the other side surface of the second component, and
wherein a thickness of a portion between the upper edge and the lower edge of the first through cavity where the first recess is not applied is different from a thickness of a portion between the upper edge and the lower edge of the second through cavity where the second recess is not applied.
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