US 12,035,484 B2
Wiring circuit board
Kenya Takimoto, Osaka (JP); Naoki Shibata, Osaka (JP); and Hayato Takakura, Osaka (JP)
Assigned to NITTO DENKO CORPORATION, Osaka (JP)
Appl. No. 17/610,060
Filed by NITTO DENKO CORPORATION, Osaka (JP)
PCT Filed Mar. 31, 2020, PCT No. PCT/JP2020/014757
§ 371(c)(1), (2) Date Nov. 9, 2021,
PCT Pub. No. WO2020/230470, PCT Pub. Date Nov. 19, 2020.
Claims priority of application No. 2019-092724 (JP), filed on May 16, 2019.
Prior Publication US 2022/0201871 A1, Jun. 23, 2022
Int. Cl. H05K 3/44 (2006.01); H05K 1/11 (2006.01)
CPC H05K 3/445 (2013.01) [H05K 1/115 (2013.01); H05K 2201/09563 (2013.01); H05K 2203/0323 (2013.01); H05K 2203/0723 (2013.01)] 3 Claims
OG exemplary drawing
 
3. A wiring circuit board, comprising:
a metal support layer,
an insulating layer disposed on one side in a thickness direction of the metal support layer, and
a conductive layer disposed on one side in the thickness direction of the insulating layer, and including a terminal portion and a ground lead residual portion electrically connected to the terminal portion,
wherein the insulating layer has a through hole penetrating in the thickness direction,
wherein the ground lead residual portion has an opening continuous so as to surround the through hole, and
wherein the ground lead residual portion includes:
a via portion disposed in the opening and filling the through hole, and
a peripheral end portion defining the opening and located at spaced intervals to the via portion.