US 12,035,477 B2
Electronic module and method for producing an electronic module
Andreas Meyer, Speichersdorf (DE); Karsten Schmidt, Eschenbach (DE); and Tilo Welker, Neuhaus (DE)
Assigned to ROGERS GERMANY GMBH, Eschenbach (DE)
Appl. No. 17/910,151
Filed by Rogers Germany GmbH, Eschenbach (DE)
PCT Filed Mar. 8, 2021, PCT No. PCT/EP2021/055760
§ 371(c)(1), (2) Date Sep. 8, 2022,
PCT Pub. No. WO2021/180639, PCT Pub. Date Sep. 16, 2021.
Claims priority of application No. 102020106521.3 (DE), filed on Mar. 10, 2020.
Prior Publication US 2023/0094926 A1, Mar. 30, 2023
Int. Cl. H05K 1/18 (2006.01); H05K 1/03 (2006.01); H05K 3/42 (2006.01)
CPC H05K 1/181 (2013.01) [H05K 1/0306 (2013.01); H05K 1/183 (2013.01); H05K 3/429 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09545 (2013.01); H05K 2201/10666 (2013.01); H05K 2203/049 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An electronics module, comprising:
a metal-ceramic substrate serving as a carrier and having a ceramic element and a primary component metallization,
an insulation layer directly or indirectly connected to the primary component metallization,
a secondary component metallization which is connected to the side of the insulation layer facing away from the metal-ceramic substrate and is isolated from the primary component metallization by the insulation layer,
wherein the ceramic element has a first size and the insulation layer has a second size and wherein a ratio of the second size to the first size assumes a value which is smaller than 0.8, to form an island-like insulation layer on the primary component metallization,
wherein at least one recess is inserted into the primary component metallization, wherein the island-like insulation layer and the secondary component metallization are arranged in the at least one recess.