CPC H05K 1/0284 (2013.01) [B29C 64/118 (2017.08); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); H05K 1/181 (2013.01); H05K 3/0044 (2013.01); H05K 3/284 (2013.01); B29L 2031/3425 (2013.01); H05K 2201/09045 (2013.01); H05K 2203/1305 (2013.01)] | 4 Claims |
1. A three-dimensional (3D) printed circuit board (PCB) composite structure comprising:
a PCB, the PCB comprising a plurality of grooves in a surface of the PCB;
a 3D printed composite structure printed on the PCB at locations of the plurality of grooves in the surface of the PCB an electronic component mounted to the surface of the PCB within the 3D printed composite structure; and
an encapsulant within the 3D printed composite structure, the encapsulant covering the electronic component,
wherein the 3D printed composite structure comprises a plurality of retaining walls deposited in the plurality of grooves in the surface of the PCB.
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