US 12,035,462 B2
Electronic device and printed circuit board including structure for removing electrical stress
Hongkyu Lee, Suwon-si (KR); and Hyoseok Na, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Dec. 22, 2021, as Appl. No. 17/559,204.
Application 17/559,204 is a continuation of application No. PCT/KR2021/019176, filed on Dec. 16, 2021.
Claims priority of application No. 10-2020-0178131 (KR), filed on Dec. 18, 2020.
Prior Publication US 2022/0201846 A1, Jun. 23, 2022
Int. Cl. H04R 1/04 (2006.01); H04R 1/08 (2006.01); H04R 3/00 (2006.01); H04R 19/04 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01)
CPC H05K 1/0259 (2013.01) [H04R 1/04 (2013.01); H04R 1/086 (2013.01); H04R 3/00 (2013.01); H04R 19/04 (2013.01); H05K 1/115 (2013.01); H05K 1/141 (2013.01); H05K 1/144 (2013.01); H04R 2201/003 (2013.01); H04R 2499/11 (2013.01); H05K 2201/041 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10151 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a multi layered printed circuit board (PCB) comprising a plurality of PCBs arranged in a stack, the multi layered PCB further comprising a hole penetrating the plurality of PCBs;
a microphone disposed on a first surface of the multi layered PCB, a sound being delivered from outside the electronic device to the microphone through the hole penetrating the plurality of PCBs; and
an electrical conductive path formed in at least a part of the hole, the electrical conductive path extending along a surface layer forming the hole in a direction in which the hole penetrates the plurality of PCBs,
wherein the electrical conductive path is electrically connected to at least one of a ground of the multi layered PCB or a ground of the microphone.