CPC H05K 1/0259 (2013.01) [H04R 1/04 (2013.01); H04R 1/086 (2013.01); H04R 3/00 (2013.01); H04R 19/04 (2013.01); H05K 1/115 (2013.01); H05K 1/141 (2013.01); H05K 1/144 (2013.01); H04R 2201/003 (2013.01); H04R 2499/11 (2013.01); H05K 2201/041 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10151 (2013.01)] | 20 Claims |
1. An electronic device comprising:
a multi layered printed circuit board (PCB) comprising a plurality of PCBs arranged in a stack, the multi layered PCB further comprising a hole penetrating the plurality of PCBs;
a microphone disposed on a first surface of the multi layered PCB, a sound being delivered from outside the electronic device to the microphone through the hole penetrating the plurality of PCBs; and
an electrical conductive path formed in at least a part of the hole, the electrical conductive path extending along a surface layer forming the hole in a direction in which the hole penetrates the plurality of PCBs,
wherein the electrical conductive path is electrically connected to at least one of a ground of the multi layered PCB or a ground of the microphone.
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