US 12,035,102 B2
Sound absorbing material encapsulation structure for sound production device, and sound production device
Jiapeng Niu, Shandong (CN); and Zhijun Sun, Shandong (CN)
Assigned to GOERTEK INC., Weifang (CN)
Appl. No. 17/786,586
Filed by GOERTEK INC., Shandong (CN)
PCT Filed Nov. 11, 2020, PCT No. PCT/CN2020/126923
§ 371(c)(1), (2) Date Jun. 17, 2022,
PCT Pub. No. WO2021/120915, PCT Pub. Date Jun. 24, 2021.
Claims priority of application No. 201911319291.X (CN), filed on Dec. 19, 2019.
Prior Publication US 2023/0018827 A1, Jan. 19, 2023
Int. Cl. H04R 1/02 (2006.01); H04R 1/28 (2006.01); H04R 9/02 (2006.01); H04R 9/06 (2006.01)
CPC H04R 1/288 (2013.01) [H04R 1/025 (2013.01); H04R 9/025 (2013.01); H04R 9/06 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A sound absorbing material encapsulation structure for a sound production device, comprising:
a rigid cavity wall enclosed to form a cavity of the sound absorbing material encapsulation structure, the cavity is configured to accommodate a sound absorbing material, the rigid cavity wall is provided with air permeability holes arranged in an array, and the air permeability holes are configured to form a channel for air to flow in and out of the sound absorbing material encapsulation structure, and diameters of the air permeability holes are smaller than a diameter of the sound absorbing material;
a bottom plate sealed and connected to one end surface of the rigid cavity wall, the bottom plate is configured to support the sound absorbing material; and
a covering plate provided to cover another end surface of the rigid cavity wall, the covering plate is sealed and connected to the rigid cavity wall.