US 12,034,444 B2
Customizing a semiconductor product
Rui Pimenta, Irvine, CA (US); Abbas Saadat, Irvine, CA (US); Jonathan Brett, Irvine, CA (US); and Xuemin Chen, Irvine, CA (US)
Assigned to Avago Technologies International Sales Pte. Limited, Singapore (SG)
Filed by AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED, Singapore (SG)
Filed on Apr. 1, 2022, as Appl. No. 17/711,851.
Prior Publication US 2023/0318605 A1, Oct. 5, 2023
Int. Cl. H03K 19/0185 (2006.01)
CPC H03K 19/018585 (2013.01) 39 Claims
OG exemplary drawing
 
1. A semiconductor product, comprising:
a customizing unit configured for customizing the semiconductor product into one of a plurality of different customized configurations selected by a received customizing data structure specifying a selected application of the semiconductor product, wherein the semiconductor product comprises a supplied security-sensitive semiconductor product from a product supplier entity to a product recipient entity;
a data structure created by the product supplier entity to customize the supplied security-sensitive semiconductor product in accordance with an application of the supplied semiconductor product specified by the product recipient entity; and
wherein a configuration of the supplied security-sensitive semiconductor product is customized based on the data structure and in accordance with the specified application;
and
a plurality of functional blocks each configured for providing an assigned functionality and all being deactivated when the semiconductor product is not in one of the customized configurations;
wherein the customizing unit is configured for activating only a subgroup of the functional blocks based on the received customizing data structure, wherein the semiconductor product is configured with multi-security feature resources allowing the product supplier entity to customize the semiconductor product with at least two different security features by activating at least part of the multi-security feature resources.