US 12,034,204 B2
Antenna for wearable device
Woo Suk Kang, Seoul (KR); Chae Up Yoo, Seoul (KR); In Young Lee, Hwaseong-si (KR); Jae Kwang Sim, Uiwang-si (KR); Jeong Ho Ahn, Suwon-si (KR); Jin Woo Jung, Seoul (KR); Se Woong Kim, Gimhae-si (KR); and Jae Bong Chun, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on May 30, 2023, as Appl. No. 18/203,102.
Application 18/203,102 is a continuation of application No. 17/134,832, filed on Dec. 28, 2020, granted, now 11,688,931.
Application 17/134,832 is a continuation of application No. 16/117,179, filed on Aug. 30, 2018, granted, now 10,879,597, issued on Dec. 29, 2020.
Claims priority of application No. 10-2017-0110533 (KR), filed on Aug. 30, 2017.
Prior Publication US 2023/0299471 A1, Sep. 21, 2023
Int. Cl. H01Q 1/27 (2006.01); G04G 21/02 (2010.01); G04G 21/04 (2013.01); G04R 60/06 (2013.01); G04R 60/12 (2013.01); H01Q 1/24 (2006.01); H01Q 3/24 (2006.01); H01Q 9/04 (2006.01); H01Q 9/24 (2006.01); H01Q 9/42 (2006.01); H01Q 5/378 (2015.01); H01Q 7/00 (2006.01)
CPC H01Q 1/273 (2013.01) [G04G 21/02 (2013.01); G04G 21/025 (2013.01); G04G 21/04 (2013.01); G04R 60/06 (2013.01); G04R 60/12 (2013.01); H01Q 1/24 (2013.01); H01Q 1/243 (2013.01); H01Q 1/27 (2013.01); H01Q 3/24 (2013.01); H01Q 9/04 (2013.01); H01Q 9/0464 (2013.01); H01Q 9/42 (2013.01); H01Q 5/378 (2015.01); H01Q 7/00 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A wearable electronic device comprising:
a housing comprising a metal structure comprising metal inclusive material;
a display positioned within the housing, the display including a metal inclusive layer positioned within the metal structure and spaced apart from the metal structure by at least a gap;
a printed circuit board (PCB) positioned within the housing and including a ground region and a control circuit configured to feed a first point of the metal structure; and
at least one conductive connection member, comprising a conductive material, electrically connected with a third point of the metal structure;
wherein the metal inclusive layer is electrically connected with the ground region of the PCB at a second point spaced apart from the first point by a given angle,
wherein at least a portion of the at least one conductive connection member is configured to couple with the ground region of the PCB.