US 12,034,201 B2
Chip packaging structure
Shao-Lun Liaw, Taichung (TW); and Yu-Cheng Li, Taichung (TW)
Assigned to SES RFID SOLUTIONS GmbH, Dusseldorf (DE)
Filed by SES RFID SOLUTIONS GmbH, Dusseldorf (DE)
Filed on Jul. 21, 2022, as Appl. No. 17/870,016.
Claims priority of provisional application 63/245,090, filed on Sep. 16, 2021.
Claims priority of application No. 111123125 (TW), filed on Jun. 21, 2022.
Prior Publication US 2023/0082794 A1, Mar. 16, 2023
Int. Cl. H01Q 1/22 (2006.01); H01Q 1/36 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01Q 1/36 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A chip packaging structure, comprising:
a chip module; and
a main body comprising a first portion, a second portion, and a holding portion, wherein the second portion protrudes from the first portion, and a size of the second portion is smaller than a size of the first portion; the holding portion is located at the second portion, the holding portion of the main body is located at a side of the second portion away from the first portion, and the chip module is placed on the holding portion;
wherein the chip module is placed at the holding portion to be engaged with the main body;
wherein the chip packaging structure further comprises a linear antenna, the linear antenna comprises a first extending portion, a second extending portion, and a winding portion; the first extending portion is connected to the winding portion, the second extending portion is connected to the winding portion, and the winding portion winds around the chip module.