US 12,034,093 B2
Semiconductor device
Toshiki Koyama, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/310,146
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Nov. 25, 2019, PCT No. PCT/JP2019/046004
§ 371(c)(1), (2) Date Jul. 21, 2021,
PCT Pub. No. WO2020/158130, PCT Pub. Date Aug. 6, 2020.
Claims priority of application No. 2019-013978 (JP), filed on Jan. 30, 2019.
Prior Publication US 2022/0093806 A1, Mar. 24, 2022
Int. Cl. H01L 31/024 (2014.01); H01L 27/146 (2006.01)
CPC H01L 31/024 (2013.01) [H01L 27/14634 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a substrate that comprises metal wiring;
a solid-state imaging element mounted on a surface of the substrate; and
an adhesive portion having a specific thermal conductivity, wherein the adhesive portion adheres a specific region on one surface of the solid-state imaging element to the substrate, wherein
the substrate comprises an insulating film on the surface,
the insulating film comprises an exposed portion that opens in the specific region to expose the metal wiring, and
the adhesive portion adheres the specific region of the solid-state imaging element to the metal wiring of the substrate.