US 12,034,032 B2
Micro LED device and method of manufacturing the same
Joohun Han, Hwaseong-si (KR); Junhee Choi, Seongnam-si (KR); Kiho Kong, Suwon-si (KR); Jinjoo Park, Yongin-si (KR); Nakhyun Kim, Yongin-si (KR); and Junghun Park, Yongin-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Apr. 28, 2023, as Appl. No. 18/308,895.
Application 18/308,895 is a continuation of application No. 16/922,147, filed on Jul. 7, 2020, granted, now 11,670,667.
Claims priority of application No. 10-2019-0131387 (KR), filed on Oct. 22, 2019.
Prior Publication US 2023/0317768 A1, Oct. 5, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 33/00 (2010.01); H01L 27/15 (2006.01)
CPC H01L 27/156 (2013.01) [H01L 33/0093 (2020.05); H01L 33/0095 (2013.01); H01L 33/007 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A micro light emitting diode (LED) display, comprising:
a support substrate;
a light emitting layer provided on the support substrate, the light emitting layer comprising:
a stacked structure including a first semiconductor layer, an active layer, and a second semiconductor layer;
a first electrode and a second electrode provided on a first side and a second side of the stacked structure, respectively; and
a plurality of light emitting regions each corresponding a pixel;
a bonding layer between the support substrate and the light emitting layer;
a drive layer provided on the light emitting layer and comprising a drive element, the drive element being electrically connected to the light emitting layer and configured to apply power to the plurality of light emitting regions of the light emitting layer; and
a color conversion layer including a plurality of color conversion regions for converting a light emitted from the light emitting layer into light colors,
wherein the support substrate is a separate substrate from a growth substrate on which the stacked structure of the light emitting layer is formed through a semiconductor deposition process, and the bonding layer is formed between the support substrate and the light emitting layer by bonding the support substrate to the growth substrate.