US 12,034,028 B2
Semiconductor package and related methods
Shou-Chian Hsu, Zhubei (TW)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Apr. 20, 2022, as Appl. No. 17/659,885.
Application 17/659,885 is a continuation of application No. 15/831,697, filed on Dec. 5, 2017, granted, now 11,342,375.
Prior Publication US 2022/0246660 A1, Aug. 4, 2022
Int. Cl. H01L 27/14 (2006.01); H01L 27/146 (2006.01)
CPC H01L 27/14632 (2013.01) [H01L 27/14618 (2013.01); H01L 27/14685 (2013.01); H01L 27/14687 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13 (2013.01); H01L 2924/181 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An image sensor package comprising:
an image sensor chip;
a first layer comprising an opening therethrough coupled to a first side of the image sensor chip;
an optically transmissive cover coupled to the first layer, wherein the optically transmissive cover, the first layer, and the image sensor chip comprise a cavity within the image sensor package;
at least one electrical contact coupled to a second side of the image sensor chip opposing the first side; and
an encapsulant coating an entirety of sidewalls of the image sensor package;
wherein a width of the optically transmissive cover is the same as a width of the first side of the image sensor chip.