US 12,034,022 B2
Image sensor including partition patterns
Kyoung-In Lee, Gyeonggi-do (KR)
Assigned to SK HYNIX INC., Icheon-si (KR)
Filed by SK hynix Inc., Gyeonggi-do (KR)
Filed on Mar. 16, 2021, as Appl. No. 17/202,919.
Application 17/202,919 is a continuation of application No. 16/219,680, filed on Dec. 13, 2018, granted, now 10,950,642.
Prior Publication US 2021/0272997 A1, Sep. 2, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 27/146 (2006.01); H04N 25/772 (2023.01)
CPC H01L 27/14621 (2013.01) [H01L 27/14603 (2013.01); H01L 27/14623 (2013.01); H01L 27/14627 (2013.01); H01L 27/14645 (2013.01); H04N 25/772 (2023.01)] 16 Claims
OG exemplary drawing
 
1. An image sensor comprising:
a substrate;
photo-sensing elements formed in the substrate;
an antireflection layer formed over of the photo-sensing elements;
color filters formed over the antireflection layer;
grid patterns between the color filters over the antireflection layer;
partition patterns between the color filters, the partition patterns surrounding the grid patterns;
grooves formed in upper portions of the partition patterns; and
micro lenses formed over the partition patterns and the color filters,
wherein lower ends of the grooves are lower than top surfaces of the color filters, and
wherein top surfaces of the partition patterns and top surfaces of the color filters are coplanar.