US 12,033,994 B2
Display panel and preparation method thereof
Zhijun Lv, Beijing (CN); Feng Zhang, Beijing (CN); Liwen Dong, Beijing (CN); Wenqu Liu, Beijing (CN); Xiaoxin Song, Beijing (CN); Zhao Cui, Beijing (CN); Detian Meng, Beijing (CN); Libo Wang, Beijing (CN); Dongfei Hou, Beijing (CN); and Qi Yao, Beijing (CN)
Assigned to BOE Technology Group Co., Ltd., Beijing (CN)
Filed by BOE Technology Group Co., Ltd., Beijing (CN)
Filed on Mar. 17, 2021, as Appl. No. 17/204,562.
Claims priority of application No. 202010863186.9 (CN), filed on Aug. 25, 2020.
Prior Publication US 2022/0068899 A1, Mar. 3, 2022
Int. Cl. H01L 25/16 (2023.01); H01L 23/00 (2006.01); H01L 27/12 (2006.01); H01L 33/62 (2010.01)
CPC H01L 25/167 (2013.01) [H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/98 (2013.01); H01L 27/1262 (2013.01); H01L 33/62 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83048 (2013.01); H01L 2224/838 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0066 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A display panel, comprising:
a base substrate provided with a circuit area and a light-emitting area;
a driving circuit in the circuit area of the base substrate;
an organic insulating layer covering the light-emitting area of the base substrate;
a light-emitting element embedded in the organic insulating layer, wherein an overlap area between an orthographic projection of the light-emitting element on the base substrate and an orthographic projection of the driving circuit on the base substrate is 0, and the light-emitting element comprises a bottom surface facing the base substrate, a top surface facing away from the base substrate, and side surfaces between the bottom surface and the top surface; wherein the bottom surface and the side surfaces are in direct contact with the organic insulating layer, the light-emitting element is provided with a first electrode at a side, facing away from the base substrate, of the light-emitting element;
a first lapping electrode on the side, facing away from the base substrate, of the light-emitting element, wherein the light-emitting element is electrically connected to the driving circuit through the first lapping electrode; and
an interlayer insulating layer between a film layer in which the first lapping electrode is located and the light-emitting element, wherein the interlayer insulating layer is in direct contact with the top surface and is made of an inorganic material;
wherein the organic insulating layer further covers the circuit area; and
the driving circuit comprises an active layer, a gate insulating layer and a gate sequentially stacked on the base substrate, and wherein
the light-emitting element is electrically connected to the first lapping electrode through at least one first via hole penetrating through the interlayer insulating layer;
the first lapping electrode is electrically connected to the active layer through a second via hole penetrating through the interlayer insulating layer and the organic insulating layer;
a position at which the first electrode is electrically connected to the first lapping electrode is external to the organic insulating layer; and
the organic insulating layer, which is in direct contact with the bottom surface and the side surfaces and through which the second via hole penetrates, is a continuously distributed single film made of a same organic material.
 
9. A preparation method of the display panel of claim 1, comprising:
forming the driving circuit in the circuit area of the base substrate;
forming the organic insulating layer covering the light-emitting area on the base substrate;
adhering the light-emitting element to a box alignment substrate through pyrolysis adhesives;
aligning and bonding the box alignment substrate with the light-emitting element and the base substrate on which the organic insulating layer is formed through an aligning device, to embed the light-emitting element within the organic insulating layer; wherein the overlap area between the orthographic projection of the light-emitting element on the base substrate and the orthographic projection of the driving circuit on the base substrate is 0;
peeling off the pyrolysis adhesives; and
forming the first lapping electrode on the side, facing away from the base substrate, of the light-emitting element; wherein the light-emitting element is electrically connected to the driving circuit through the first lapping electrode.