US 12,033,988 B2
Apparatus for separating semiconductor elements and method for fabricating light-emitting elements using the same
In Hyuk Kim, Hwaseong-si (KR); Dong Gyun Kim, Seoul (KR); Jae Hoon Jung, Seoul (KR); Jin Oh Kwag, Yongin-si (KR); Hee Yeon Yoo, Hwaseong-si (KR); Sung Chan Jo, Seoul (KR); Jeong In Choi, Asan-si (KR); Hye Jung Hong, Cheonan-si (KR); Jong Hyuk Kang, Suwon-si (KR); Dong Eon Lee, Hwaseong-si (KR); and Hyun Min Cho, Seoul (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed by Samsung Display Co., LTD., Yongin-si (KR)
Filed on Jul. 22, 2021, as Appl. No. 17/382,825.
Claims priority of application No. 10-2020-0093975 (KR), filed on Jul. 28, 2020.
Prior Publication US 2022/0037292 A1, Feb. 3, 2022
Int. Cl. H01L 25/075 (2006.01); H01L 21/68 (2006.01); H01L 21/78 (2006.01); H01L 33/00 (2010.01)
CPC H01L 25/0753 (2013.01) [H01L 21/68 (2013.01); H01L 21/7806 (2013.01); H01L 33/005 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a base comprising a receiving portion that receives a solvent and a substrate on which semiconductor elements are disposed; and
at least one ultrasonic generator that generates and applies ultrasonic waves to the substrate placed in the base, wherein
the base comprises sidewalls surrounding the receiving portion,
the at least one ultrasonic generator further comprises:
second ultrasonic generators disposed on sidewalls of the base in a first direction; and
third ultrasonic generators disposed on sidewalls of the base in a second direction in a plan view, and
the second ultrasonic generators and the third ultrasonic generators generate ultrasonic waves in a direction horizontal to the lower surface of the base.