US 12,033,984 B2
Semiconductor device
Mitsuhiro Kakefu, Matsumoto (JP); and Hiroaki Ichikawa, Azumino (JP)
Assigned to FUJI ELECTRIC CO., LTD., Kawasaki (JP)
Filed by FUJI ELECTRIC CO., LTD., Kawasaki (JP)
Filed on May 12, 2023, as Appl. No. 18/316,783.
Application 18/316,783 is a continuation of application No. 17/153,957, filed on Jan. 21, 2021, granted, now 11,688,722.
Application 17/153,957 is a continuation in part of application No. 17/004,372, filed on Aug. 27, 2020, granted, now 11,515,292, issued on Nov. 29, 2022.
Application 17/004,372 is a continuation of application No. PCT/JP2019/028851, filed on Jul. 23, 2019.
Claims priority of application No. 2018-175498 (JP), filed on Sep. 20, 2018.
Prior Publication US 2023/0282622 A1, Sep. 7, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 25/07 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 29/739 (2006.01); H01L 29/861 (2006.01)
CPC H01L 25/072 (2013.01) [H01L 23/49844 (2013.01); H01L 24/48 (2013.01); H01L 29/7393 (2013.01); H01L 29/861 (2013.01); H01L 2224/48225 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a semiconductor unit, including
a first arm part that includes
a first semiconductor chip having a control electrode, which is a first control electrode, on a front surface thereof,
a second semiconductor chip having a control electrode, which is a second control electrode, on a front surface thereof,
a first circuit pattern on which the first semiconductor chip and the second semiconductor chip are disposed, the first circuit pattern forming a single first collector pattern of the first arm part,
a second circuit pattern to which the first control electrode and the second control electrode are connected, and
a first control wire extending in a first direction and electrically connecting the first control electrode, the second control electrode, and the second circuit pattern sequentially; and
a second arm part that includes
a third semiconductor chip having a control electrode, which is a third control electrode, on a front surface thereof,
a fourth semiconductor chip having a control electrode, which is a fourth control electrode, on a front surface thereof,
a third circuit pattern on which the third semiconductor chip and the fourth semiconductor chip are disposed, the third circuit pattern forming a single second collector pattern of the second arm part,
a fourth circuit pattern to which the third control electrode and the fourth control electrode are connected, and
a second control wire extending in the first direction and electrically connecting the third control electrode, the fourth control electrode, and the fourth circuit pattern sequentially.