US 12,033,971 B2
Compressible foamed thermal interface materials and methods of making the same
Vijayaraghavan Rajagopal, Lincoln, NE (US); Eugene Anthony Pruss, Avon Lake, OH (US); and Richard F. Hill, Parkman, OH (US)
Assigned to Laird Technologies, Inc., Chesterfield, MO (US)
Filed by Laird Technologies, Inc., Chesterfield, MO (US)
Filed on Sep. 29, 2023, as Appl. No. 18/374,770.
Application 18/374,770 is a continuation of application No. 17/694,363, filed on Mar. 14, 2022, granted, now 11,776,928.
Application 17/694,363 is a continuation of application No. 16/513,031, filed on Jul. 16, 2019, granted, now 11,276,662, issued on Mar. 15, 2021.
Application 16/513,031 is a continuation of application No. PCT/US2018/013947, filed on Jan. 17, 2018.
Claims priority of provisional application 62/447,012, filed on Jan. 17, 2017.
Prior Publication US 2024/0105663 A1, Mar. 28, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/00 (2006.01); C08J 9/12 (2006.01); F28F 13/00 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01)
CPC H01L 24/29 (2013.01) [F28F 13/003 (2013.01); H01L 23/4334 (2013.01); H01L 24/27 (2013.01); H01L 24/83 (2013.01); C08J 9/122 (2013.01); H01L 23/3731 (2013.01); H01L 23/3736 (2013.01); H01L 23/3737 (2013.01); H01L 2224/29005 (2013.01); H01L 2224/29187 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/29195 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29391 (2013.01); H01L 2924/3025 (2013.01)] 28 Claims
 
1. A compressible foamed thermal interface material comprising a matrix, at least one thermally-conductive filler within the matrix, and a plurality of pores, wherein the compressible foamed thermal interface material has a sufficiently closed porosity such that the matrix is connected relatively well thereby enabling the compressible foamed thermal interface material to maintain a thermal conductivity of at least about 1.5 Watts per meter Kelvin.