CPC H01L 24/29 (2013.01) [F28F 13/003 (2013.01); H01L 23/4334 (2013.01); H01L 24/27 (2013.01); H01L 24/83 (2013.01); C08J 9/122 (2013.01); H01L 23/3731 (2013.01); H01L 23/3736 (2013.01); H01L 23/3737 (2013.01); H01L 2224/29005 (2013.01); H01L 2224/29187 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/29195 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29391 (2013.01); H01L 2924/3025 (2013.01)] | 28 Claims |
1. A compressible foamed thermal interface material comprising a matrix, at least one thermally-conductive filler within the matrix, and a plurality of pores, wherein the compressible foamed thermal interface material has a sufficiently closed porosity such that the matrix is connected relatively well thereby enabling the compressible foamed thermal interface material to maintain a thermal conductivity of at least about 1.5 Watts per meter Kelvin.
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