US 12,033,954 B2
Packaged module with ball grid array and grounding pins for signal isolation, method of manufacturing the same, and wireless device comprising the same
Howard E. Chen, Anaheim, CA (US); David Viveiros, Jr., Newbury Park, CA (US); Russ Alan Reisner, Oxnard, CA (US); and Robert Francis Darveaux, Corona Del Mar, CA (US)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by SKYWORKS SOLUTIONS, INC., Irvine, CA (US)
Filed on Jan. 24, 2022, as Appl. No. 17/582,915.
Application 17/582,915 is a continuation of application No. 15/883,294, filed on Jan. 30, 2018, granted, now 11,233,014.
Claims priority of provisional application 62/451,774, filed on Jan. 30, 2017.
Prior Publication US 2022/0254730 A1, Aug. 11, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H01L 23/66 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 23/49816 (2013.01); H01L 23/50 (2013.01); H01L 24/17 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3025 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A packaged module comprising:
a packaging substrate having an upper side and an underside;
an upper-side component mounted on the upper side of the packaging substrate;
an overmold implemented on the upper side of the packaging substrate and dimensioned to encapsulate the upper-side component;
an underside component mounted to the underside of the packaging substrate; and
a ball grid array implemented on the underside of the packaging substrate to accommodate the underside component and to allow the packaged module to be mounted on a circuit board, the ball grid array having a height dimensioned to accommodate the underside component, the height of the ball grid array being greater than a height of the underside component, the ball grid array including a signal pin for passing of a signal, a plurality of non-ground pins, and a plurality of grounding shielding pins arranged to provide a selective electromagnetic isolation between the signal pin and the underside component, and to provide a selective electromagnetic isolation between the signal pin and another signal pin of the ball grid array, the ball grid array arranged such that one or more of the non-ground pins is/are positioned immediately next to a side of the underside component.
 
8. A method for manufacturing a packaged module, the method comprising:
forming or providing a packaging substrate having an upper side and an underside;
mounting an upper-side component on the upper side of the packaging substrate;
implementing an overmold on the upper side of the packaging substrate to encapsulate the upper-side component;
arranging a ball grid array on the underside of the packaging substrate to define a mounting region; and
mounting an underside component within the mounting region such that the ball grid array allows the packaged module to be mounted on a circuit board, and such that the ball grid array includes a signal pin for passing of a signal, a plurality of non-ground pins, and a plurality of grounding shielding pins arranged to provide a selective electromagnetic isolation between the signal pin and the underside component, and to provide a selective electromagnetic isolation between the signal pin and another signal pin of the ball grid array, the ball grid array arranged such that one or more of the non-ground pins is/are positioned immediately next to a side of the underside component, the ball grid array having a height dimensioned to accommodate the underside component, the height of the ball grid array being greater than a height of the underside component.
 
14. A wireless device comprising:
a circuit board configured to receive a plurality of modules;
a transceiver implemented on the circuit board;
an antenna in communication with the transceiver and configured to support either or both of transmission and reception of respective signals; and
a radio-frequency module mounted on the circuit board with a ball grid array of the radio-frequency module such that the radio-frequency module is electrically coupled between the transceiver and the antenna, the radio-frequency module including a packaging substrate having an upper side and an underside with the ball grid array implemented on the underside of the packaging substrate, the radio-frequency module further including an upper-side component mounted to the upper side of the packaging substrate, an overmold implemented on the upper side of the packaging substrate and dimensioned to encapsulate the upper-side component, and an underside component mounted to the underside of the packaging substrate, the ball grid array having a height dimensioned to accommodate the underside component, the height of the ball grid array being greater than a height of the underside component, the ball grid array including a signal pin for passing of a signal, a plurality of non-ground pins, and a plurality of grounding shielding pins arranged to provide a selective electromagnetic isolation between the signal pin and the underside component, and to provide electromagnetic isolation between the signal pin and another signal pin of the ball grid array, the ball grid array arranged such that one or more of the non-ground pins is/are positioned immediately next to a side of the underside component.