US 12,033,945 B2
Microelectronic device interface configurations, and associated methods, devices, and systems
Hayato Oishi, Tokyo (JP); Satoru Sugimoto, Tokyo (JP); and Hiroki Hosaka, Tokyo (JP)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Mar. 27, 2020, as Appl. No. 16/832,550.
Prior Publication US 2021/0305159 A1, Sep. 30, 2021
Int. Cl. H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 23/50 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01)
CPC H01L 23/5286 (2013.01) [H01L 23/5226 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02372 (2013.01); H01L 2924/1434 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A device, comprising:
a first row of power supply pads;
a first row of input/output (DQ) pads, wherein the first row of power supply pads is offset from the first row of DQ pads in a first dimension and each DQ pad of the first row of DQ pads is at least partially offset from each power supply pad of the first row of power supply pads in a second, different dimension;
a row of vias, the first row of DQ pads positioned at least partially between the row of vias and the first row of power supply pads; and
a number of conductors, each via of the row of vias coupled, via a dedicated conductor of the number of conductors, to either a power supply pad of the first row of power supply pads or a DQ pad of the first row of DQ pads, wherein each DQ pad of the first row of DQ pads is at least partially separated from an adjacent DQ pad of the first row of DQ pads by a conductor of the number of conductors, wherein a maximum length of each conductor of the number of conductors coupling a via of the row of vias to a DQ pad of the first row of DQ pads is approximately 10 micrometers.