US 12,033,936 B2
Resonant inductive-capacitive isolated data channel
Klaas De Haan, Berltsum (NL); Mikhail Valeryevich Ivanov, Freising (DE); Tobias Bernhard Fritz, Mainburg (DE); Swaminathan Sankaran, Allen, TX (US); and Thomas Dyer Bonifield, Dallas, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Oct. 10, 2022, as Appl. No. 17/963,149.
Application 17/963,149 is a division of application No. 17/120,123, filed on Dec. 12, 2020, granted, now 11,476,189.
Prior Publication US 2023/0031204 A1, Feb. 2, 2023
Int. Cl. H01L 23/522 (2006.01); H01L 21/50 (2006.01); H01L 23/50 (2006.01); H04L 25/02 (2006.01)
CPC H01L 23/5227 (2013.01) [H01L 21/50 (2013.01); H01L 23/50 (2013.01); H01L 23/5222 (2013.01); H04L 25/0268 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method of manufacturing a packaged electronic device, the method comprising:
forming a first dielectric layer on a side of a substrate;
forming a first metal layer on the first dielectric layer, the first metal layer having a first plate;
forming a second dielectric layer on the first dielectric layer and on the first metal layer;
forming a second metal layer on the second dielectric layer, the second metal layer comprising:
a second plate spaced apart from the first plate; and
a winding around the second plate in a resonant circuit; and
forming a protective overcoat layer on the second dielectric layer and on the second metal layer, the protective overcoat layer having an opening that exposes a portion of the second plate.