US 12,033,927 B2
Method for manufacturing wiring substrate
Isao Ohno, Ogaki (JP); Tomoya Daizo, Ogaki (JP); Yoji Sawada, Ogaki (JP); and Kazuhiko Kuranobu, Ogaki (JP)
Assigned to IBIDEN CO., LTD., Ogaki (JP)
Filed by IBIDEN CO., LTD., Gifu (JP)
Filed on Jun. 29, 2021, as Appl. No. 17/361,522.
Claims priority of application No. 2020-118814 (JP), filed on Jul. 9, 2020.
Prior Publication US 2022/0013409 A1, Jan. 13, 2022
Int. Cl. H01L 21/48 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/49822 (2013.01) [H01L 21/4857 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for manufacturing a wiring substrate, comprising:
forming a plurality of conductor pads on an insulating layer such that the plurality of conductor pads includes a plurality of first conductor pads and a plurality of second conductor pads;
forming a plurality of protruding parts on surfaces of the first conductor pads of the plurality of conductor pads, respectively;
forming a resin layer such that the resin layer covers the insulating layer and the plurality of conductor pads;
exposing, from the resin layer, end portions of the protruding parts on an opposite side with respect to the insulating layer;
forming, in the resin layer, a plurality of openings such that the openings expose surfaces of the second conductor pads of the plurality of conductor pads, respectively; and
forming a coating film on the surfaces of the second conductor pads exposed in the openings.