US 12,033,901 B2
Device and method used for measuring wafers
Bin Li, Shanghai (CN); and Haijun Gao, Shanghai (CN)
Assigned to Raintree Scientific instruments (Shanghai) Corporation, Shanghai (CN)
Appl. No. 17/290,706
Filed by Raintree Scientific Instruments (Shanghai) Corporation, Shanghai (CN)
PCT Filed Nov. 1, 2019, PCT No. PCT/CN2019/115124
§ 371(c)(1), (2) Date Jun. 16, 2021,
PCT Pub. No. WO2020/088669, PCT Pub. Date May 7, 2020.
Claims priority of application No. 201811300273.2 (CN), filed on Nov. 2, 2018.
Prior Publication US 2022/0020648 A1, Jan. 20, 2022
Int. Cl. H01L 21/12 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01)
CPC H01L 22/12 (2013.01) [H01L 21/67253 (2013.01); H01L 21/681 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A device for measuring wafers, comprising:
a moving platform, for adjusting the location of wafers;
a first pre-alignment module and a first image recognition module, for aligning a first wafer at a first location on the moving platform before measuring the first wafer;
a second pre-alignment module and a second image recognition module, for aligning a second wafer at a second location on the moving platform before measuring the second wafer; and
a measurement module, for measuring the first wafer at a third location on the moving platform while the second wafer is being aligned at the second location on the moving platform and measuring the second wafer at the third location on the moving platform after measuring the first wafer;
wherein the first location, the second location and the third location are different from each other.