US 12,033,886 B2
Plasma processing apparatus and method for manufacturing mounting stage
Yasuharu Sasaki, Miyagi (JP); Ryo Chiba, Miyagi (JP); and Akira Nagayama, Miyagi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Feb. 22, 2019, as Appl. No. 16/282,552.
Claims priority of application No. 2018-032364 (JP), filed on Feb. 26, 2018.
Prior Publication US 2019/0267277 A1, Aug. 29, 2019
Int. Cl. H01L 21/687 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/68785 (2013.01) [H01J 37/32724 (2013.01); H01L 21/67109 (2013.01); H01L 21/6831 (2013.01); H01J 2237/3343 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A plasma processing apparatus comprising:
a mounting stage including
a plate-like member,
which has a mounting surface, on which an object to be processed is mounted, and a back surface provided on a side opposite to the mounting surface, and
in which a first hole penetrating through the mounting surface and the back surface is formed, and
a base
which has a supporting surface supporting the plate-like member, the back surface of the plate-like member and the supporting surface of the base forming a joint face, and
in which a second hole penetrating through the supporting surface and communicating with the first hole is formed; and
an embedment member disposed inside the first hole and the second hole and including a first embedment member disposed inside the first hole and a second embedment member disposed inside the second hole,
wherein the first embedment member and the second embedment member are not mutually fixed at an interfacial boundary between a part of the first hole formed on the back surface of the plate-like member and a part of the second hole formed on the supporting surface of the base,
wherein the first embedment member has a portion having a wider width at a lower end than an upper end,
wherein an entirety of the portion having the wider width at the lower end of the first embedment member is positioned above a horizontally upper end surface of the second embedment member,
wherein the first embedment member has a diameter that is smaller than a diameter of the first hole and the second embedment member has a diameter that is smaller than a diameter of the second hole so that a heat transfer gas path is formed between an outer peripheral surface of the first embedment member and an inner wall of the first hole and between an outer peripheral surface of the second embedment member and an inner wall of the second hole,
wherein the first embedment member and the inner wall of the first hole form a first interval that penetrates from the mounting surface and the back surface of the plate-like member,
wherein the second embedment member and the inner wall of the second hole form a second interval that penetrates from the supporting surface and a second back surface of the base,
wherein a recess is formed at a peripheral edge of an upper end portion of the second embedment member, and
wherein the recess is formed so that the heat transfer gas path is maintained while the first embedment member and the second embedment member are horizontally misaligned.