US 12,033,835 B2
Modular microwave source with multiple metal housings
Philip Allan Kraus, San Jose, CA (US); Robert Moore, Bigfork, MT (US); James Carducci, Sunnyvale, CA (US); Richard Fovell, San Jose, CA (US); Sathya Swaroop Ganta, Sunnyvale, CA (US); Karthikeyan Balaraman, Bangalore (IN); and Silverst Rodrigues, Bangalore (IN)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jun. 10, 2020, as Appl. No. 16/898,259.
Prior Publication US 2021/0391149 A1, Dec. 16, 2021
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32467 (2013.01) [H01J 37/3222 (2013.01); H01J 37/3244 (2013.01); H01J 37/32513 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An assembly comprising:
a source array, wherein the source array comprises a dielectric plate and a plurality of dielectric resonators extending up from a surface of the dielectric plate; and
a housing assembly over the source array, wherein the housing assembly comprises:
a first conductive layer over the surface of the dielectric plate, wherein the first conductive layer comprises a first coefficient of thermal expansion (CTE);
a second conductive layer over the first conductive layer, wherein the second conductive layer comprises a second CTE that is different than the first CTE; and
a plurality of openings through the housing assembly, wherein each opening passes through the first conductive layer and the second conductive layer, and wherein each opening accommodates one of the plurality of dielectric resonators.