US 12,033,805 B2
Multilayer electronic component
Seon Ho Park, Suwon-si (KR); Jae Seok Yi, Suwon-si (KR); Moon Soo Park, Suwon-si (KR); and Chang Hak Choi, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Oct. 19, 2022, as Appl. No. 17/969,189.
Claims priority of application No. 10-2022-0064307 (KR), filed on May 25, 2022.
Prior Publication US 2023/0386749 A1, Nov. 30, 2023
Int. Cl. H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a plurality of dielectric layers and internal electrodes;
external electrodes disposed on the body to be connected to the internal electrodes; and
a metal oxide disposed between the body and the external electrodes,
wherein
the metal oxide includes calcium (Ca), zinc (Zn), silicon (Si), and at least one selected from the group consisting of barium (Ba), boron (B), and aluminum (Al).