US 12,033,804 B2
Multilayer electronic component
Seo Won Jung, Suwon-si (KR); Won Kuen Oh, Suwon-si (KR); Gyu Ho Yeon, Suwon-si (KR); and Seo Ho Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Mar. 30, 2022, as Appl. No. 17/708,461.
Claims priority of application No. 10-2021-0192965 (KR), filed on Dec. 30, 2021.
Prior Publication US 2023/0215650 A1, Jul. 6, 2023
Int. Cl. H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer interposed therebetween, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and
external electrodes disposed on the body,
wherein the external electrodes each include a first electrode layer disposed on the third or fourth surface and a second electrode layer including a center portion disposed on the first electrode layer and a band portion extending from the center portion onto a portion of the first surface and a portion of the second surface,
the first electrode layer includes a conductive metal,
the second electrode layer includes silver (Ag) and glass and further includes one or more of palladium (Pd), platinum (Pt), or gold (Au),
ta<tb, wherein ta is a maximum thickness of the center portion and tb is a maximum thickness of the band portion, and
0.25≤ta/tb<0.45 is satisfied.