US 12,033,797 B2
Discrete metal-insulator-metal (MIM) energy storage component and manufacturing method
Vincent Desmaris, Gothenburg (SE); Rickard Andersson, Gothenburg (SE); Muhammad Amin Saleem, Gothenburg (SE); Maria Bylund, Gothenburg (SE); Anders Johansson, Öckerö (SE); Fredrik Liljeberg, Gothenburg (SE); Ola Tiverman, Västra Frölunda (SE); and M Shafiqul Kabir, Västra Frölunda (SE)
Assigned to SMOLTEK AB, Gothenburg (SE)
Appl. No. 17/283,105
Filed by Smoltek AB, Gothenburg (SE)
PCT Filed Oct. 7, 2019, PCT No. PCT/SE2019/050975
§ 371(c)(1), (2) Date Apr. 6, 2021,
PCT Pub. No. WO2020/080993, PCT Pub. Date Apr. 23, 2020.
Claims priority of application No. 1851284-8 (SE), filed on Oct. 18, 2018.
Prior Publication US 2022/0013305 A1, Jan. 13, 2022
Int. Cl. H01G 11/36 (2013.01); H01G 11/56 (2013.01); H01M 10/0585 (2010.01); H01M 50/11 (2021.01); H05K 1/18 (2006.01)
CPC H01G 11/36 (2013.01) [H01G 11/56 (2013.01); H01M 10/0585 (2013.01); H01M 50/11 (2021.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10037 (2013.01)] 31 Claims
OG exemplary drawing
 
1. A discrete metal-insulator-metal (MIM) energy storage component, comprising:
a substrate having a first side and a second side opposite the first side;
a MIM-arrangement on the first side of the substrate, the MIM-arrangement comprising:
a first electrode layer deposited on the first side of the substrate;
a plurality of conductive nanostructures grown from said first electrode layer;
a conduction controlling material covering each conductive nanostructure in said plurality of conductive nanostructures and said first electrode layer left uncovered by said conductive nanostructures; and
a second electrode layer covering said conduction controlling material;
a first connecting structure for external electrical connection of said discrete MIM energy storage component;
a second connecting structure for external electrical connection of said discrete MIM energy storage component; and
an electrically insulating encapsulation material at least partly embedding said MIM-arrangement, in such a way that the electrically insulating encapsulation material at least partly forms an outer boundary surface of the discrete MIM energy storage component;
wherein the second side of the substrate at least partly forms the outer boundary surface of the discrete MIM energy storage component.