US 12,033,674 B2
Reduction of high tape contact pressure points against head assembly
Oscar J. Ruiz, San Jose, CA (US); Kenji Kuroki, Fujisawa (JP); and Eduardo Torres Mireles, San Jose, CA (US)
Assigned to Western Digital Technologies, Inc., San Jose, CA (US)
Filed by Western Digital Technologies, Inc., San Jose, CA (US)
Filed on Nov. 21, 2022, as Appl. No. 17/991,620.
Application 17/991,620 is a continuation in part of application No. 17/184,547, filed on Feb. 24, 2021, abandoned.
Claims priority of provisional application 63/068,632, filed on Aug. 21, 2020.
Prior Publication US 2023/0087767 A1, Mar. 23, 2023
Int. Cl. G11B 15/60 (2006.01); G11B 5/255 (2006.01); G11B 5/265 (2006.01); G11B 5/40 (2006.01)
CPC G11B 5/2655 (2013.01) [G11B 5/255 (2013.01); G11B 5/40 (2013.01); G11B 15/60 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A magnetic recording head assembly, configured to read from and write to a magnetic media, comprising:
one or more rows of chiplets, each of the one or more rows of chiplets having a leading edge, a trailing edge, a first side edge, and a second side edge, the first and second side edges being disposed between the leading edge and the trailing edge; and
one or more sensor guards disposed adjacent to at least one of the first side edge and the second side edge of each of the one or more of rows of chiplets, wherein each of the one or more sensor guards comprises:
a first surface disposed at a first media facing surface (MFS);
a second surface disposed perpendicular to the first surface; and
a chamfered surface coupling the first surface to the second surface, wherein the chamfered surface of each of the one or more sensor guards has a first ratio of depth to width between about 0.01 and about 0.2 so as to enable contact of the magnetic media during read and write operations.