US 12,033,032 B2
Modular quantum processor architectures
Michael Justin Gerchick Scheer, Oakland, CA (US); Maxwell Benjamin Block, Oakland, CA (US); Benjamin Jacob Bloom, Oakland, CA (US); Matthew J. Reagor, Corte Madera, CA (US); Alexander Papageorge, San Francisco, CA (US); Kamal Yadav, Fremont, CA (US); Nasser Alidoust, Berkeley, CA (US); Colm Andrew Ryan, Albany, CA (US); Shane Arthur Caldwell, Oakland, CA (US); Yuvraj Mohan, Fremont, CA (US); Anthony Polloreno, Carlsbad, CA (US); John Morrison Macaulay, Emeryville, CA (US); and Blake Robert Johnson, El Cerrito, CA (US)
Assigned to Rigetti & Co, LLC, Berkeley, CA (US)
Filed by Rigetti & Co, LLC, Berkeley, CA (US)
Filed on Dec. 11, 2020, as Appl. No. 17/119,089.
Application 17/119,089 is a continuation of application No. PCT/US2019/037303, filed on Jun. 14, 2019.
Claims priority of provisional application 62/684,855, filed on Jun. 14, 2018.
Prior Publication US 2021/0342729 A1, Nov. 4, 2021
Int. Cl. G06F 15/78 (2006.01); G06F 30/373 (2020.01); G06F 30/392 (2020.01); G06F 30/3947 (2020.01); G06N 10/40 (2022.01)
CPC G06N 10/40 (2022.01) [G06F 15/7896 (2013.01); G06F 30/373 (2020.01); G06F 30/392 (2020.01); G06F 30/3947 (2020.01)] 8 Claims
OG exemplary drawing
 
1. A modular quantum processor comprising:
a first quantum processor chip supported on a substrate layer and comprising a first plurality of qubit devices;
a second quantum processor chip supported on the substrate layer and comprising a second plurality of qubit devices; and
a cap structure supported on the first and second quantum processor chips and comprising an active coupler device, wherein the active coupler device is configured to selectively couple at least one of the first plurality of qubit devices with at least one of the second plurality of qubit devices.